Stock Taper
| DATE | TYPE | RATIO |
|---|---|---|
| 2002-04-17 | Forward | 2:1 |
| 2000-03-16 | Forward | 2:1 |
| 1997-10-14 | Forward | 2:1 |
| 1995-10-13 | Forward | 2:1 |
| 1993-10-06 | Forward | 2:1 |
| 1992-04-07 | Forward | 2:1 |
| 1986-05-16 | Forward | 2:1 |
| 1981-02-06 | Forward | 3:2 |
| 1980-04-02 | Forward | 3:2 |
Applied Materials, Inc. provides manufacturing equipment, services, and software for the semiconductor, display, and related industries worldwide, focusing on fabrication, optimization, and display technologies.
The Kinex™ Bonding System, co-developed with Besi, is the industry’s first fully integrated die-to-wafer hybrid bonding platform for high-volume advanced semiconductor packaging, enabling denser, high-performance chiplet designs for AI, HPC, and s...
| Icon | PRODUCT | Q4-2025 | Q1-2026 | Q2-2026 | Q3-2026 |
|---|---|---|---|---|---|
| Semiconductor Systems | $4.76B | $5.14B ▲ | $5.96B ▲ | $7.04B ▲ | |
![]() | Applied Global Services | $1.63B | $1.56B ▼ | $1.67B ▲ | $1.78B ▲ |
![]() | Corporate And Reconciling Items | $1.12B | $312M ▼ | $280M ▼ | $294M ▲ |
| Map | REGION | Q4-2025 | Q1-2026 | Q2-2026 | Q3-2026 |
|---|---|---|---|---|---|
![]() | CHINA | $1.96B | $2.1B ▲ | $2.09B ▼ | $2.51B ▲ |
![]() | TAIWAN PROVINCE OF CHINA | $1.83B | $1.72B ▼ | $2.15B ▲ | $2.02B ▼ |
![]() | KOREA REPUBLIC OF | $1.22B | $1.46B ▲ | $1.57B ▲ | $1.52B ▼ |
![]() | UNITED STATES | $655M | $656M ▲ | $941M ▲ | $1.37B ▲ |
![]() | JAPAN | $448M | $525M ▲ | $623M ▲ | $839M ▲ |
![]() | Europe | $220M | $221M ▲ | $347M ▲ | $483M ▲ |
![]() | South East Asia | $460M | $335M ▼ | $185M ▼ | $374M ▲ |
Overall rating: B+
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