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ASX

ASE Technology Holding Co., Ltd.

ASX

ASE Technology Holding Co., Ltd. NYSE
$14.95 3.82% (+0.55)

Market Cap $32.38 B
52w High $16.39
52w Low $6.94
Dividend Yield 0.36%
P/E 30.51
Volume 5.36M
Outstanding Shares 2.17B

Income Statement

Period Revenue Operating Expense Net Income Net Profit Margin Earnings Per Share EBITDA
Q3-2025 $168.569B $15.676B $10.87B 6.448% $5 $32.396B
Q2-2025 $150.75B $15.494B $7.521B 4.989% $3.48 $26.989B
Q1-2025 $148.153B $15.222B $7.554B 5.099% $3.5 $27.158B
Q4-2024 $162.264B $14.248B $9.312B 5.739% $4.3 $26.571B
Q3-2024 $160.105B $14.956B $9.666B 6.037% $4.48 $28.588B

Balance Statement

Period Cash & Short-term Total Assets Total Liabilities Total Equity
Q3-2025 $83.412B $842.644B $503.091B $317.043B
Q2-2025 $76.903B $765.175B $450.24B $293.77B
Q1-2025 $93.535B $774.177B $439.154B $311.522B
Q4-2024 $85.869B $740.698B $398.789B $320.026B
Q3-2024 $78.354B $714.559B $383.506B $309.399B

Cash Flow Statement

Period Net Income Cash From Operations Cash From Investing Cash From Financing Net Change Free Cash Flow
Q3-2025 $13.976B $14.626B $-45.829B $27.718B $2.357B $-30.294B
Q2-2025 $9.255B $36.845B $-43.573B $21.497B $-4.315B $-6.259B
Q1-2025 $9.81B $19.973B $-37.561B $16.411B $607M $-16.376B
Q4-2024 $9.312B $35.245B $-31.557B $-2.073B $4.782B $630.02M
Q3-2024 $12.26B $22.062B $-22.362B $8.398B $5.538B $2.293B

Five-Year Company Overview

Income Statement

Income Statement Revenue has grown over the five‑year period, but it has cooled from the peak reached during the pandemic boom. Sales have recovered modestly after a dip, while profit margins are clearly lower than in the best year, reflecting a more normal, competitive environment and softer demand in some segments. Even so, the business remains consistently profitable, with earnings that look solid rather than spectacular in the most recent years. Overall, this reads like a mature cyclical tech manufacturer coming off a strong up‑cycle, not a company in distress.


Balance Sheet

Balance Sheet The balance sheet has been steadily building in scale. Total assets and shareholders’ equity have both risen over time, suggesting the company is reinvesting and strengthening its capital base. Debt has also increased, but not in a way that looks out of control relative to the growth in equity and assets. Cash on hand has trended higher compared with earlier years, giving some flexibility to handle downturns and fund projects. In simple terms, the financial foundation appears sturdier now than it was five years ago, albeit with the usual leverage that comes with a capital‑intensive semiconductor business.


Cash Flow

Cash Flow The company generates healthy cash from its operations year after year, which is a key positive for a manufacturing‑heavy business. Free cash flow, however, swings quite a bit because capital spending is high and uneven. In years when investment in new capacity and technology is heavy, the free cash left over after those outlays shrinks. That pattern suggests management is prioritizing long‑term growth and capability over short‑term cash surplus. The cash profile is typical of a leading semiconductor packaging player: good underlying cash generation, but lumpy and often absorbed by expansion projects.


Competitive Edge

Competitive Edge ASE holds a leading position as the world’s largest outsourced semiconductor assembly and test provider, with clear advantages in scale, customer relationships, and global footprint. Its size allows it to spread fixed costs, negotiate better with suppliers, and support a broad range of customer needs across regions. Deep ties with major chipmakers, including a close alliance with TSMC, reinforce its role in advanced packaging and testing for cutting‑edge chips. High switching costs and complex qualification processes make it painful for customers to move away, which helps protect its business. The flip side is exposure to semiconductor cycles, fierce competition from other large OSATs, customer concentration, and geopolitical risks around its core Asian manufacturing base.


Innovation and R&D

Innovation and R&D Technologically, ASE is at the sharp end of semiconductor packaging. It has built strong know‑how in advanced packaging methods like heterogeneous integration, fan‑out packaging, 2.5D and 3D integration, and System‑in‑Package solutions, all of which are critical for AI, high‑performance computing, and advanced automotive chips. Its VIPack design ecosystem and related tools deepen integration with customers by helping them co‑design packages and speed up development. The company continues to pour resources into next‑generation areas such as co‑packaged optics and panel‑level packaging, which aim to boost performance and cut costs in future data‑center and high‑density applications. This innovation push strengthens its moat but also demands sustained R&D and capital spending, with the usual execution and adoption risks if certain technologies mature more slowly than expected.


Summary

Overall, ASE looks like a scale leader in a strategic part of the semiconductor supply chain, combining solid profitability, a gradually strengthening balance sheet, and strong operating cash generation with an aggressive investment agenda in advanced packaging. Its main strengths lie in its market leadership, tight integration with top chipmakers, and deep technology portfolio aligned with fast‑growing areas like AI and high‑performance computing. Key risks center on industry cyclicality, capital intensity, margin pressure when demand softens, concentration in certain customers and regions, and the need to continually execute on complex, leading‑edge technologies. For now, the financials portray a robust, if cyclical, specialist that is spending heavily to remain at the forefront of its niche.