Stock Taper
| DATE | TYPE | RATIO |
|---|---|---|
| 2018-04-18 | Forward | 5:4 |
| 2012-08-20 | Forward | 1139:1000 |
| 2011-08-12 | Forward | 557:500 |
| 2010-07-27 | Forward | 109:100 |
| 2008-08-13 | Forward | 1029:1000 |
| 2007-08-20 | Forward | 11479:10000 |
| 2005-09-07 | Forward | 5499:5000 |
| 2004-08-25 | Forward | 5287:5000 |
| 2003-08-22 | Forward | 11:10 |
| 2001-07-17 | Forward | 117:100 |
ASE Technology provides semiconductor packaging, testing, and electronic manufacturing services globally, including advanced chip packages, system-in-package solutions, and related services across multiple industries.
FOPoP, part of ASE's VIPack™ platform, is a cutting-edge semiconductor packaging solution that vertically stacks components to enhance bandwidth and reduce latency for advanced mobile, networking, and AI applications.
| Icon | PRODUCT | FY2019 | FY2020 | FY2021 | FY2022 |
|---|---|---|---|---|---|
![]() | Packaging service | $198.92B | $218.67B ▲ | $272.54B ▲ | $303.95B ▲ |
![]() | Electronic components manufacturing service | $165.79B | $204.69B ▲ | $239.49B ▲ | $301.97B ▲ |
![]() | Testing service | $42.66B | $47.27B ▲ | $49.98B ▲ | $55.96B ▲ |
![]() | Other Products And Services | $5.82B | $6.35B ▲ | $7.99B ▲ | $9B ▲ |
| Map | REGION | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
![]() | UNITED STATES | $446.48B | $370.31B ▼ | $358.71B ▼ | $365.79B ▲ |
![]() | TAIWAN PROVINCE OF CHINA | $83.66B | $70.49B ▼ | $89.27B ▲ | $115.97B ▲ |
![]() | Asia | $75.99B | $75.32B ▼ | $82.99B ▲ | $97.82B ▲ |
![]() | Europe | $63.54B | $65.03B ▲ | $63.43B ▼ | $64.91B ▲ |
Overall rating: B-
| PEER | PRICE | |
|---|---|---|
HPE | $52.30 | COMPARE |
MPWR | $1256.26 | COMPARE |
TER | $354.97 | COMPARE |
NOK | $10.21 | COMPARE |
ALAB | $289.47 | COMPARE |
MCHP | $72.93 | COMPARE |
ERIC | $9.95 | COMPARE |
CTSH | $64.04 | COMPARE |